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3U 3647 Narrow Heatsink

Main Features

1. 5PCS U-type heat pipe and Aluminum fin make good cooling more powerful & effective

2. TDP above 215W good for the workstations, 3U Up server appliances etc.

3. Higher quality material using CU1100 basement +AL6063+AL1100+5PIPE

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Features

    Item No

    3647-3N05AS

    Application

    3U Server and up, Workstation

    Socket Type

    LGA3647(Narrow Type,68x95x69 mmMounting Pitch)

    Compatibility

    Recommend for Intel® Xeon® Platinum / Gold Family Processor ( products formerly Skylake ), Socket FCLGA3647

    TDP

    215W* Please noted the cooperatation of the application environment airduct.)

    Fin pitch

    1.71mm

    Fin thickness

    0.3mm

    Material

    CU1100+AL6063+AL1100+5PIPE

    Overall Dimensions

    101L x 92.5W x 125.4H (mm)

    Weight

    690g

    Thermal Interface Material

    AD66Thermally conductivity > 4.0

    DC Fan Size

    90x90x25 mm

    Rated Voltage

    12 V

    Rated Current

    0.4 A

    Bearing Type

    Two Balls

    Rated Speed

    2800±10%RPM

    Air Flow

    42.64CFM

    Static Pressure

    3.65mmH2O

    Noise Level

    33.4dB(A)  

    Life Expectancy

    70,000 Hours, at 40, 15%~65%RH

    Connection Lead Type

    4 pins, with PWM

    Unit Price (100pcs/order)

    Pls contact the sale. Thanks

     

     

    * Please noted the cooperatation of the application environment airduct.)

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